Localized machining and deposition for microelectronic components by sputtering

ABSTRACT

A SPUTTERING PROCESS IS DESCRIBED THAT IS SUITABLE FOR HIGHLY LOCALIZED DEPOSITION AND MACHINING OF ELEMENTS OF MICROELECTRONIC COMPONENTS EMPLOYING A STREAM OF GAS IN AN ATMOSPHERE AT LEAST WITHIN AN ORDER OF MAGNITUDE OF ATMOSPHERIC PRESSURE BETWEEN CLOSELY SPACED SPUTTERING ELECTRODES WHICH ARE PREFERABLY SUPPORTED BY THE COMPONENT SUBSTRATE. APPLICATIONS TO MICROELECTRONIC COMPONENTS SUCH AS FOR TUNING THE VIBRATORY MEMBERS OF RESONANT GATE TRANSISTORS ARE DESCRIBED.



